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Core Competencies

Technical Details to Detailed Engineering Capabilities

Capabilities to complement any customer

The bullet points. Gotta have ’em. If you’ve found your way here, you are probably searching for technical detail. These lists present our core competencies; our engineering expertise in hardware, firmware, mechanical, test and system design. We complement our customers’ capabilities and build upon our services through specialty design partners.

Capabilities

  • 8, 16 and 32 bit Microprocessors, Microcontrollers
    • ARM or CORTEX processor technologies
    • CISC processor families
  • Analog signal conditioning & Interfacing
  • Low level sensor interfacing (RTD, thermocouples, strain gauges)
    • Pressure sensors
    • Accelerometers
  • Frequency inputs & outputs
  • Power drive electronics (H-Bridge, BLDC, valves solenoids, indicators, outputs up to 165 amps)
  • Motor Control
  • Flat panel display systems / LCD touch screens
  • Serial / Network communications
    • Ethernet
    • CAN 2.0B
    • RS-232 / 422 / 485
    • MIL-STD-1533
    • I2C
    • SPI
    • USB
  • Vehicle OBD communication
    • J1939LS / HS
    • J1850 PWM / VPW
    • J1708 / J1587
    • J2284
    • ISO 9141
    • ISO 14230
    • LIN
  • Wireless communications
    • Wi-Fi 802.11 a/b/g/n
    • ZigBee 802.15.4
    • GPS / GLONASS
    • Cellular
    • Satellite
    • Bluetooth / BLE
    • NFC
  • Cord Reel Design
  • Battery technology product design
  • Schematic capture
  • Multi-layer PCB design (including High Density)
  • Circuit simulations
  • Fault Tree Analysis (FTA)
  • Worse case analysis (WCA)
  • Design failure modes & effects analysis (DFMEA)
  • Design for Manufacturing (DFM)

Operating Systems

  • Real-time Operating Systems (RTOS)
  • Embedded Linux

Drivers

  • CDMA (1xRTT)
  • GSM (GPRS, 3G, 4G)
  • TCP, UDP
  • GPS, (Binary, NMEA)
  • SPI, I2C, UART, ADC, PWM
  • CAN 2.0B compliant drivers
  • J1939, J1708, J1850, J2284, KWP2000 protocols

APIs/BSPs

  • Custom board support packages
  • Custom boot loaders
  • Custom API development

Languages

  • C/C++
  • Assembly
  • Embedded Java, J2ME
  • Custom scripting

Areas of Expertise

  • High Density Electronic Packaging to IP67 and IP69 certification
    • Molded plastic
    • Diecast
    • Sheet cast & machined metal
    • Hermetic enclosure
    • Sealing (TPE, FIP,potting, ultrasonic, chemical welds, VHB)
  • Plastic part design for product enclosures
    • IMD (In Mold Decoration)
    • IML (In Mold Label)
    • IMT (In Mold Transfer)
    • Insert Molding
    • 2-shot
    • Overmold
    • Design for Paint and Soft Touch
  • Metal cast part design for product enclosures
    • Diecast (Aluminum and Zinc)
    • Thin wall Mag
    • Thixo (with or without TPE overmolding)
    • CNC (for low volume needs)
  • Materials selection
    • Engineered thermoplastics (PC,PC/ABS,Acetal,Nylons,PBT,PP,PEEK,PEI,Torlon,….)
    • TPE / TPU / Si
    • Cast metals
    • Sheet metals (SS, CRS, Ti, BeCu, CuNi, Phos Bronze, NiAg
  • Sheet metal design
    • Fence and Lid PCB shields
    • Drawn pcb shields
    • Pick and Place with tape and reel custom spring forms
    • Progressive Die spring forms
  • Thin and Heavy wall Plastic Extrusion
  • Aluminum Extrusion design
  • Keypad design (high tactility/ sealed)
    • LGF Backlit
    • Hard Capped
    • Membrane
    • Blob-Top
  • Rack & panel applications
  • Weldments, fabrications & bracketry
  • Rapid prototyping (3D printing, CNC, Rubber Molding)
  • Thermal analysis, compliance testing
  • Shock/vibration, compliance testing
  • Conceptual design through prototype build/test/debug
  • Industrial design (outsourced partner)

In-House Simulation

  • Statics & dynamics
  • Strength of materials & solid mechanics
  • Instrumentation & measurement
  • Thermodynamics, heat transfer, energy conversion
  • Fluid mechanics & fluid dynamics (outsource partner)
  • Material engineering
  • Solid modeling
  • Design for manufacturing
  • Non-linear (via outside partners)

RF

  • FCC Testing
  • Global Approvals
  • GSM, CDMA, GPS, BT

Environmental Testing

  • Temperatures
    • Extremes
    • Cycling
    • Shock
    • Stress
  • Humidity
  • Salt Spray
  • Salt Fog
  • Water Immersion
  • Ice
  • Oils & Chemical Exposure
    • High Exposure Splash
    • Light to Moderate Splash
    • Immersion
  • Steam Cleaning & Pressure Washing
  • Fungus
  • Dust & Sand
  • Gravel Bombardment
  • Altitude
  • Vibration
    • Sweep Sine
    • Random Vibration
  • Mechanical Shock
    • Operational Shock
    • Crash Shock
    • Drop test
    • Shipping & Handling Shock
  • Combined Environmental Testing
  • Highly Accelerated Life Testing (HALT)

Steady State

  • 12VDC & 24VDC Systems
  • Normal Operating
  • Cold Cranking
  • Jump Start
  • Reverse Polarity
  • Voltage Regulator Failure

Transients

  • Conducted
    • Load Dump
    • Inductive Switching
    • Burst Transients
    • Starter Motor Engagement
  • Coupled
    • Electrical Fast
    • Chattering Relay
  • ESD
    • Handling
    • In Vehicle

EMC/EMI

  • Radiated emissions
  • Conducted emissions
  • Bulk current injection

Test Plans for OEM Specific Standards

Test Plans for Global Standards

  • ISO
  • SAE
  • IEC
  • CE / R&TTE / E-mark
  • UL
  • NEMA
  • MIL
  • ASME

Process

  • Performance test
  • Requirements driven test development
  • Requirements testing traceability
  • Functional testing capabilities

Testing Methods

  • Regression testing
  • Black box testing
  • White box testing
  • Negative testing
  • Exploratory testing
  • Vehicle testing
  • Field testing

Areas of Expertise

  • Electronic controllers
  • Connected devices
  • Wireless devices
  • Signal conditioning
  • Power distribution modules
  • Protocol gateways
  • Backend service integration testing
  • Vehicle communication protocol testing

Automation

  • Test automation
  • Peripheral emulation
  • Vehicle bus simulation
  • Parametric testing
  • Test tools development

Areas of Expertise

  • Customer requirements analysis
  • Customer requirements development
  • Product and system level requirements definition
  • Requirements management
  • Validation test co-definition
  • Product technical design
    • Block diagram
    • Component level pinout
    • Systems analysis and architecture
  • Requirements traceability
  • Product systems checkout
  • Test incident tracking and lifecycle management
  • Customer Support
    • Product integration
    • Debugging and troubleshooting
    • Product functionality training
    • On-site installation coaching

What are your technology needs?  Let's Talk.   630.754.2300

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